There’s no bigger question facing the tech sector today than how to scale AI. Kandou’s chiplet designs are providing part of the answer, assisting the biggest memory users like hyperscalers with the jump in memory bandwidth and capacity they require. But those solutions are based on a core vision that…
Microchips have been around since the late 1950s, and have been a byword for cutting edge technology ever since. But it seems that the era of the monolith do-it-all chip is coming to an end, and the age of the chiplet has arrived.
IP Optimized for High-Speed, Ultra-Low Power Chiplet Interconnects. SAINT-SULPICE, SWITZERLAND – January 18, 2023 Who: Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link intellectual property (IP) solutions that improve the way the world connects and communicates. What: Will demonstrate Glasswing™ chip-to-chip link intellectual property (IP) optimized for high-speed, ultra-low power ultra-short…