Revolutionizing wired connectivity is a complicated job, and we need dedicated, visionary professionals to make it happen. Kandou’s collaborative, diverse culture is tailormade to give you the support, guidance and rewards you’re looking for, and the day-to-day challenges that come with going beyond in one of the fastest changing and most exciting areas of tech engineering.
We offer our employees a hybrid working model with flexible working hours to help provide a better work-life balance. As part of our team you will benefit from a management style that provides you with the autonomy to develop, along with the support you need to grow. You will work in a dynamic, multicultural environment with experts who are passionate about chip technology and its potential to make a difference in a connected world.
We require a Packaging Engineer to be based in UK (Scotland, Reading or Northampton) or Taiwan. We need someone with an authority in assembly manufacturing, implementing and evolving process control plans as appropriate. You will also drive the promotion of Design for Manufacture (DFM) philosophy within Kandou, providing input to package technology selection and design aligned with Kandou’s product requirements.
You will have experience working in a commercially driven organisation as part of a dynamic Product Development and Operations team, with Advanced skills with all MS Office Products, especially Excel and PowerPoint are essential, along with the ability to drive, plan and manage your own workload. If this role appeals to you, please get in touch using the link below.
We are looking for a passionate Product Engineer based in East Kilbride, Scotland. You will be responsibility for all Product engineering activities at Kandou, along with managing all aspects of statistical analysis of data to support NPI, Production and Customer Return activities. You will work with Yield Management Systems to continue to develop tools to deliver best in class functionality. You will also co-work with Test Development Team to approve release to production of test programs, by determining production readiness, using GR&R methodology.
If you have +2 years semi-conductor industry experience with knowledge of manufacturing processes, test equipment, FA techniques and data analysis best practices, please do get in touch using the link below.
Gareth, Product Engineer
UK
Yosra, R&D Digital Design Engineer
Switzerland
Fabrice, Sales Operations Manager
Switzerland
