Tigerwing Archives - Kandou AI

Category: Tigerwing

  • Kandou AI Demonstrates Revolutionary 260 Gbps Tigerwing™ Chip-to-Chip Interface in Silicon at 2026 TSMC Europe Technology Symposium

    Kandou AI Demonstrates Revolutionary 260 Gbps Tigerwing™ Chip-to-Chip Interface in Silicon at 2026 TSMC Europe Technology Symposium

    SAINT-SULPICE, SWITZERLAND— June 4, 2026 — Kandou AI, a leading fabless semiconductor company specializing in high-speed, energy-efficient connectivity and system solutions for the AI era, today announced the successful silicon demonstration of its industry-leading Tigerwing™ Chip-to-Chip (C2C) SerDes interface on TSMC’s 4nm technology node. The demonstration took place at the…

  • Delivering Breakthrough Chip-to-Chip Connectivity with Tigerwing™

    Delivering Breakthrough Chip-to-Chip Connectivity with Tigerwing™

    At the end of August 2025, we announced a breakthrough in chip connectivity: the successful tape-out of Tigerwing™, our next-generation chip-to-chip interconnect IP, on TSMC’s leading-edge process node. In just four months from concept to tape-out, our team achieved a milestone that sets new benchmarks for innovation, performance, and speed…