Kandou Glasswing SerDes Early Test Results

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Measure Power of 0.8pJ/bit!

Testing of our Glasswing 16nm test chip is proceeding very well. This IP will deliver 500Gbps and is optimized for die-to-die interconnect inside a 150um bump pitch MCM package. A few highlights of our testing include:

  • Tx and Rx PLLs locking reliable at full rate
  • Error-free operation of all in-package links using PRBS (both internal and external pattern checkers)
  • Preliminary measured power under nominal conditions is 0.8pJ/bit; within 1-2% of our simulations!

Testing is essentially complete and characterization will start this week (week of 21 Aug). Full test/char across all foundry process corners is scheduled for completion in mid-November.

Above is a picture showing measured bathtub curves for the 5 sub-channels over 3 MCM channels: 30mm, 24mm and 5mm, all which turn corners. If you have any questions, feel free to contact me.