Kandou to Present Chord Signaling™ at ISSCC 2016
Chord Signaling Chip-to-Chip Link Technology Delivers 2-4X Bandwidth Improvement at 50% or Less Power than Traditional Signaling Methods
SAN FRANCISCO, January 27, 2016 –– Kandou Bus has announced that it will present two papers and demonstrate its Chord Signaling™ link technology at the 2016 International Solid-State Circuits Conference (ISSCC). In a technology demonstration, a paper presentation and a forum presentation at the conference, Kandou will detail its innovative coding-based signal interface, which significantly outperforms existing I/O solutions.
“The industry expects chips to double performance every two years but the technologies that enable chips to communicate to each other can’t keep up,” said Amin Shokrollahi, CEO and Founder of Kandou Bus. “Chord Signaling reduces the gap to the Shannon capacity for a given channel and allows system designers and chip architects to increase bandwidth and save power for products ranging from cell phones to high performance computing.”
Chord Signaling™ Offers Significant System-level Architectural Advantages
The core of Kandou’s innovative technology is a novel signaling method called Chord Signaling in which correlated signals are sent across more than two correlated wires. Bandwidth can be increased by a factor of 2-4X and power can be reduced by 50 percent or more, which allows for improved board, pin and silicon area efficiency as compared to existing technologies. This approach also delivers excellent signal integrity with strong resistance to common-mode noise and simultaneous switching noise and a reduction of intersymbol interference.
To fully realize the benefits of Chord Signaling, Kandou has developed proprietary circuits and architectures for all parts of the transmission chain including drivers, receivers, equalizers, CDR units and skew detection/mitigation. Additional circuitry has been developed to realize the benefits of Chord Signaling on existing PCBs on which the wires are routed as pairs.
Applications range from ultra-short reach connections ideal for 2.5D packaging to interfaces to stacked memory, standard memory interfaces like LPDDR & DDR, and SerDes links for chip-to-chip communications across PCBs & backplanes. Chord Signaling is easily adaptable to the unique requirements of virtually any chip-to-chip interface.
A silicon demonstration of Kandou’s Glasswing Chord Signaling solution optimized for 2.5D integration will take place during ISSCC’s Demonstration Session 1 on Monday evening at the San Francisco Marriott Marquis.
In session 10 on Tuesday morning, Kandou VP of Product Management Brian Holden will present the paper “A Pin-Efficient 20.83Gb/s/wire 0.94pJ/bit Forwarded Clock CNRZ-5-Coded SerDes up to 12mm for MCM Packages in 28nm CMOS.”
In Forum 4 on Thursday afternoon, Kandou Founder and CEO Amin Shokrollahi will provide a presentation, entitled “High-Speed and Low-Power SerDes Architectures Using Chord Signaling.”
The complete ISSCC program can be found at isscc.org.