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** Kandou 500Gbps Serdes IP Targets 2.5D ** Kandou’s new 16nm Glasswing hard macro enables 500Gbps interfaces between die in a 2.5D package. The IP core implements the company’s unique protocol for 5-bit over 6-wire > signaling.

The Linley Group


Kandou was elected among the top 60 emerging companies to watch by EE Times, the online news outlet that covers everything that is important in the electronics industry.


Holden explained how the ENRZ electrical interface uses four wires to transmit three bits using the codes {+1, -1/3, -1/3, -1/3}. That is, any pair or wires can carry the +1 code and the other -1/3 codes travel between any other pairs of wires. At 37.3 Gbaud, ENRZ can deliver 112.3 Gbps as where NRZ would need 56 Gbaud to achieve the same rate, if that’...

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Attendees at ISSCC’s opening-night demonstration suites were privy to testing of a special long-reach serdes developed by a Lausanne, Switzerland, startup offering new interface-signaling technologies. Kandou Bus will offer IP for use in everything from internal interposers to chip-to-chip interconnects. By employing correlated signals over a varying number of wires, the company can exceed the 25/32Gbps limit of present serdes at a lower power than traditional two-wire implementations.

Loring Wirbel, The Linley Group (Networking Report and Microprocessor Report)


We are excited for the industry to reflect how many different OIF IA projects are being applied to real-world products that are either available today or are being readied for deployment,” said Brian Holden of Kandou Bus and the OIF’s Marketing Education & Awareness Committee co-chair. “It is encouraging to see the Forum’s work coming to fruition.

Business Wire


Kandou Bus uses a novel form of spatial coding to transmit data between wired chips. The main idea is to introduce correlations between the signals sent on the interface, and choose the correlations judiciously to lower the power consumption, increase the speed, and lower the footprint. It is a generalization of differential signaling (which sends correlated signals on two wires). The company is a spinoff of Dr. Shokrollahi’s lab at the Swiss Federal Technical Institute in Lausanne.

Daniel Nenni, SemiWiki


SAN FRANCISCO. — A math professor’s observation mushroomed into a startup with two demo chips and three standards efforts. Kandou Bus aims to drive a broad range of chip-to-chip and backplane interconnects down to picojoules/bit rates measured in single digits.

Rick Merritt, EETimes


Company Announces New Chord™ signaling technology at ISSCC that delivers 2-4X bandwidth improvement and half the power of conventional chip-to-chip links

SAN FRANCISCO, February 10, 2014 – Kandou Bus has announced that the first implementation of its breakthrough high-performance, low-power link technology will be introduced at the 2014 International Solid-State Circuits Conference (ISSCC). In both a technology demonstration and a paper presentation at the conference by Kandou founder and CEO Amin Shokrollahi,

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I also had the chance to catch up with Brian Holden, who can now say more about that secretive startup he had just joined when I saw him at Hot Chips last year. Kandou Bus is developing algorithms for three-wire interconnects it claims will enable new capabilities and efficiencies for links such as 400 Gbit/second backplanes.

Rick Merritt, EETimes


I also had the chance to catch up with Brian Holden, who can now say more about that secretive startup he had just joined when I saw him at Hot Chips last year. Kandou Bus is developing algorithms for three-wire interconnects it claims will enable new capabilities and efficiencies for links such as 400 Gbit/second backplanes.

Rick Merritt, EETimes