Kandou was elected among the top 60 emerging companies to watch by EE Times, the online news outlet that covers everything that is important in the electronics industry.
Kandou Bus, S.A., the world’s highest performance and lowest energy SerDes technology company, has announced that it has completed a $15M investment with Bessemer Venture Partners. The resources will enable Kandou to expand research and accelerate the development, productization and deployment of Kandou’s Chord™ signaling SerDes technology. Kandou has developed Chord signaling for enhanced communications between chips inside electronic systems ranging from cell phones to servers and high performance computing.Read more
Kandou Bus has announced that their Glasswing™ GW28-125-USR interface macro that has been manufactured, tested and characterized, is compliant to the newly published JEDEC specification, JESD247. Titled the “Multi-Wire, Multi-Level Interface Specification”, this new specification was published by the JEDEC standards development organization in June. Kandou actively participated in the effort to define this interface, and David Stauffer of Kandou served as the chair of the JEDEC task group that produced the text. As an active JEDEC member and in full compliance with membership terms and conditions, Kandou has committed to adhere to the RAND, Reasonable and Non-Discriminatory, terms of the JEDEC standards body for the licensing of the Kandou patents to that are needed to implement this interface.
Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by Marvell Technology Group for use in a variety of future multi-chip products. Based on Kandou’s CNRZ-5 Chord™ signaling architecture, Glasswing delivers high bandwidth signaling at very low power and is ideally suited for short links inside and outside a package. Glasswing is the world’s first SerDes proven in silicon that is capable of delivering 1Tbps bandwidth at <1 watt, paving the way for fundamental architectural shifts in power savings in devices ranging from cell phones to enterprise and high-performance computing platforms.Read more
SAN FRANCISCO, January 27, 2016 – – Kandou Bus has announced that it will present two papers and demonstrate its Chord Signaling™ link technology at the 2016 International Solid-State Circuits Conference (ISSCC). In a technology demonstration, a paper presentation and a forum presentation at the conference, Kandou will detail its innovative coding-based signal interface, which significantly outperforms existing I/O solutions.Read more
Demonstrated in Glasswing™ Test Silicon and Ideal for Chip-to-Chip Links Inside a Package.Read more
For the fifth consecutive year, Kandou Bus is listed among the top 100 swiss startups.Read more
Our waiting was finally over last Monday, July 13. The multi-chip module (MCM) packages each containing four copies of our Glasswing chip arrived in our lab. The hour of truth was upon us: The chip we had painstakingly designed over a period of 5 months and for which we had prepared the grounds for another 3 months while it was being manufactured at TSMC in Taiwan was in our lab. It is a state-of-the art piece of IP: it uses our proprietary Chord Signaling technique to transmit 125 Gbps over 6 correlated wires over 12-24 mm of trace in an MCM. The entire “FedEx”ing of the bits from their reception until their delivery on the other end uses about 1 pico-jule per bit.Read more
Company to present alternative architecture for 56 Gb/s links utilizing Kandou’s Chord™ ERNZ signalling.
Lausanne, Switzerland, March 10, 2014 – Brian Holden, V.P. of Product Management at Kandou Bus, will participate in a panel discussion at OFC 2014 entitled “56 Gb/s serial: Why, What, When?”. During this panel discussion, he will highlight an alternative architecture for 56 Gb/s links that uses Kandou’s Chord™ ENRZ signaling instead of NRZ or PAM-4 signaling.
Kandou Bus is among the best 100 young businesses in Switzerland.